Camtek Joins Industry Alliance to Develop Advanced 3D Semiconductor Packaging
Camtek Will be an Advanced Optical
Inspection Partner in New York State's Tech Valley
Press Release
MIGDAL HAEMEK, Israel, June 8, 2010 Camtek Ltd.
(NASDAQ and TASE: CAMT) ("Camtek" or the "Company"),
announced today that it has entered into a joint development agreement
(JDA) with IBM Corporation (NYSE:IBM -News) and will be joining a new
industry alliance aimed at optimizing systems and processes for next-generation
three-dimensional (3D) semiconductor packaging.
Camtek has a significant role in
providing advanced optical inspection and metrology R&D expertise
for the new development program.
Following the semiconductor front-end model,
the new IBM-led R&D collaboration is bringing together a world-class ecosystem of
companies to focus specifically on packaging development.
The joint development effort is leveraging the joint resources of key manufacturers,
suppliers and customers, and it will create leading-edge packaging centers to
develop end-to-end 3D packaging solutions for the industry - establishing a host
of new best-known-methods for the semiconductor back-end.
The work will be centered
in New York's Tech Valley - a region in Eastern New York State that stretches from
Montreal to just north of New York City - and is one of the world's leading epicenter's
for nanotechnology R&D.
The new generation of 3D packaging will utilize multiple stacked
semiconductor layers with vertical connections between them.
Compared to 2D devices, the new 3D devices will enable higher
performance with lower power consumption, as well as greater bandwidth and
the integration of mixed technologies.
To be successful, these complex next-generation 3D packages
will require more advanced
defect detection abilities and more advanced metrology tools.
To address that critical need,
Camtek's new automated optical inspection (AOI) system,
will be used in the joint
development collaboration, to meet the challenge.
The Camtek tool will be delivered in the second quarter of 2010.
"We are extremely gratified that Camtek is now an inspection partner
in the IBM-led semiconductor packaging R&D ecosystem," said Roy Porat,
Camtek's General Manager. "We're looking forward to contributing our
inspection experience to this prestigious industry group and we hope
to build significant R&D competencies by helping bring advanced packaging
to the next level."
ABOUT CAMTEK LTD.
Camtek Ltd provides automated solutions dedicated
for enhancing production processes and yield,
enabling our customers new technologies in two industries;
Semiconductors, Printed Circuit Board (PCB) & IC Substrates.
Camtek addresses the specific needs of these industries
with dedicated solutions based on a wide and advanced platform of
technologies including intelligent imaging, image processing,
ion milling and digital material deposition.
Camtek's solutions range from micro-to-nano by applying its technologies to
the industry-specific requirements.
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