Oclaro and 3SPGroup Establish MSA Industry Standard Enabling Smaller and More Compact Pump Laser Packaging
New MSA Standard Defines a 10-pin Butterfly Package to Deliver a 70 Percent Reduction in Form Factor
Compared to Legacy 14-Pin Formats on the Market
New MSA Standard Defines a 10-pin Butterfly Package to Deliver a 70 Percent Reduction
in Form Factor Compared to Legacy 14-Pin Formats on the Market
September 12, 2012
SAN JOSE, Calif., Sept. 12, 2012 /PRNewswire/ -- Oclaro, Inc. (NASDAQ: OCLR), a tier-one provider and innovator of
optical communications and laser solutions, and 3SPGroup, a leading provider of innovative optical products and solutions for
lasers, sensors and telecommunications markets, today announced the establishment of a new Multi-Source Agreement (MSA) that
defines a new industry-standard Small Form Factor (SFF) pump laser package. This new industry standard will enable customers to
design amplifiers based on MSA pump laser devices in a compact 10-pin butterfly package that is approximately 30% the size of the
legacy 14-pin format package.
The new 10-pin butterfly package represents a significant advancement in pump laser packaging. The current standard for
packaging is based on a 14-pin format that has changed little over the last 15 years. As the driving forces behind the new
10-pin butterfly MSA standard, both Oclaro and 3SPGroup are enabling their customers to develop exciting, market-leading
compact amplifiers with lower costs and reduced space requirement in network equipment. In addition, by offering compatibility
with the MSA, Oclaro and 3SPGroup can ensure next generation pump lasers meet a defined and agreed mechanical outline, footprint
and electrical pin-out. This is extremely important to amplifier customers who would otherwise have to deal with many different
formats and form factors from their pump vendors.
"Lower-cost and space-efficient optical amplification with potentially higher component density is critical to implementing
complex network solutions," said Simon Loten, Director of Product Management at Oclaro, Inc. "Customers are looking for ways
to reduce form factors and they also want to standardize on one format for all their needs — whether that be cooled and uncooled
pump products or multi chip devices. This new MSA represents a significant advancement in the pump laser industry and we are
pleased to deliver this innovative new format to our customers so that they can differentiate in the market with smaller and
lower cost designs."
"We are excited to bring this new family of pump lasers (cooled or uncooled) that combine higher optical power into a small size
into the market that will help our customers to evolve their next generation network solutions. This new product family complements
our existing small size pump module offerings (MiniDIL)," said Didier Sauvage, CTO at 3SPGroup. "The industry is trending towards
smaller form factors and by establishing an MSA, customers now have a clear route and assurance that they will have multiple-vendor
About the New MSA
The new SFF 10-pin butterfly package design represents a new industry standard package platform for pump lasers. The new package
has the same pin-out, pin-pitch and front mounting hole centers as the existing legacy 14-pin so that it remains backwardly
compatible with legacy applications. Electrical connections to laser, internal thermoelectric cooler (TEC), back facet monitor
diode (BFM) and thermistor remain addressed to the same pin configuration. The MSA provides customers and the market with
assurance and security of multi-vendor supply and the backward compatibility only adds to this assurance.
Details of the MSA can be found at the following links:
Oclaro, Inc. (NASDAQ: OCLR) is one of the largest providers of lasers and optical components, modules
and subsystems for the optical communications, industrial, and consumer laser markets. The company is a
global leader dedicated to photonics innovation, with cutting-edge research and development (R&D) and chip
fabrication facilities in the U.S., U.K., Italy, Switzerland, Israel, Korea and Japan. It has in-house and
contract manufacturing sites in China, Malaysia and Thailand, with design, sales and service organizations
in most of the major regions around the world. For more information, visit
3SPGroup is a leading provider of innovative optical products and solutions for lasers, sensors and telecommunications markets.
The Group designs, develops, manufactures and sells highly reliable active & passive optical components and modules for telecom,
industrial, medical, CATV, scientific, security and defense applications. Also it develops ultra-reliable fiber-optic systems
including high-power fused components, optical sensors, fiber laser components and a complete range of fiber lasers and amplifiers.
Through its Solutions division, it provides instrumentation and integrated solutions for process and environmental monitoring
systems. For more information, visit
Copyright 2012. All rights reserved. Oclaro, the Oclaro logo, and certain other Oclaro trademarks and logos are trademarks
and/or registered trademarks of Oclaro, Inc. or its subsidiaries in the US and other countries. All other trademarks are the
property of their respective owners. Information in this release is subject to change without notice.
Oclaro is represent in Israel by New Technology SK (Newtech):